Method of Manufacturing Addressable and Static Electronic Displays

ABSTRACT

The present invention provides a method of manufacturing an electronic display. The exemplary method includes depositing a first conductive medium within a plurality of cavities of a substrate to form a plurality of first conductors. A plurality of electronic components in a suspending medium are then deposited within the plurality of cavities, and the plurality of electronic components are oriented using an applied field, followed by a bonding of the plurality of electronic components to the plurality of first conductors. A second, transmissive conductive medium is then deposited and bonded to the plurality of electronic components.

CROSS-REFERENCE TO A RELATED APPLICATION

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 11/756,616, filed May 31, 2007, inventors WilliamJohnstone Ray et al., titled “Method of Manufacturing Addressable andStatic Electronic Displays”, which is commonly assigned herewith, theentire contents of which are incorporated herein by reference with thesame full force and effect as if set forth in their entirety herein, andwith priority claimed for all commonly disclosed subject matter.

FIELD OF THE INVENTION

The present invention in general is related to electronic displaytechnology and, in particular, is related to an electronic displaytechnology capable of being printed or coated on a wide variety ofsubstrates, and which further may be electronically addressable invarious forms for real-time display of information.

BACKGROUND OF THE INVENTION

Display technologies have included television cathode ray tubes, plasmadisplays, and various forms of flat panel displays. Typical televisioncathode ray tube displays utilize an emissive coating, typicallyreferred to as a “phosphor” on an interior, front surface, which isenergized from a scanning electron beam, generally in a pattern referredto as a raster scan. Such television displays have a large, very deepform factor, making them unsuitable for many purposes.

Other displays frequently used for television, such as plasma displays,while having a comparatively flat form factor, involve a complex arrayof plasma cells containing a selected gas or gas mixture. Using row andcolumn addressing to select a picture element (or pixel), as these cellsare energized, the contained gas is ionized and emits ultravioletradiation, causing the pixel or subpixel containing a correspondingcolor phosphor to emit light. Involving myriad gas-containing andphosphor-lined cells, these displays are complicated and expensive tomanufacture, also making them unsuitable for many purposes.

Other newer display technologies, such as active and passive matrixliquid crystal displays (“LCDs”), also include such pixeladdressability, namely, the capability of individually addressing aselected picture element. Such displays include a complex array oflayers of transistors, LCDs, vertically polarizing filters, andhorizontally polarizing filters. In such displays, there is often alight source which is always powered on and emitting light, with thelight actually transmitted controlled by addressing particular LCDswithin an LCD matrix. Such addressing, however, is accomplished throughadditional layers of transistors, which control the on and off state ofa given pixel.

Currently, creation of such displays requires semiconductor fabricationtechniques to create the controlling transistors, among other things. Awide variety of technologies are involved to fabricate the liquidcrystal layer and various polarizing layers. LCD displays also arecomplicated and expensive to manufacture and, again, unsuitable for manypurposes.

As a consequence, a need remains for a scalable electronic display,which may provide substantially larger form factors, suitable forapplications such as outdoor signage. In addition, for variousapplications, such an electronic display should provide a printablesurface, for direct application of an image to be illuminated. Such anelectronic display should also provide for significant durability with acapability to withstand typical environmental conditions, especially foroutdoor applications or other applications in environments havingvariable conditions.

A further need remains for a dynamic electronic display which providesfor pixel addressability, for the display of dynamically changinginformation. Such a display further should be capable of fabricationusing printing or coating technologies, rather than using complicatedand expensive semiconductor fabrication techniques. Such a displayshould be capable of fabrication in a spectrum of sizes, from a sizecomparable to a mobile telephone display, to that of a billboard display(or larger). Such a display should also be robust and capable ofoperating under a wide variety of conditions.

SUMMARY OF THE INVENTION

The exemplary embodiments of the present invention provide a new type ofelectronic display and a new method of manufacturing such a display,using printing and coating technologies. The inventive electronicdisplay may be regional or static, such as for signage, or which may beaddressable, such as for the display of changing information. Theinventive display may be fabricated in a wide variety of sizes, from asize comparable to a mobile telephone display, to that of a billboarddisplay (or larger). The exemplary inventive displays are also robustand capable of operating under a wide variety of conditions, includingoutdoor and other stressful environmental conditions.

In an exemplary embodiment, a method of manufacturing an electronicapparatus is provided. The exemplary method comprises: depositing afirst conductive medium on a substrate to form a first conductor;depositing a plurality of electronic components; orienting the pluralityof electronic components using an applied field; and depositing asecond, optically transmissive conductive medium.

For selected exemplary embodiments, the substrate has a plurality ofcavities, which may be integrally molded in the substrate. For variousapplications, the substrate may be embossed. For these embodiments, thestep of depositing the first conductive medium further comprisesdepositing the first conductive medium in the plurality of cavities toform a plurality of first conductors. The plurality of cavities may beat least one of the following types of cavities: channels, grooves, orsubstantially hemispherically-shaped depressions or bores. The step ofdepositing the second conductive medium may also further comprisedepositing the second conductive medium to form a plurality of secondconductors. The exemplary method may also further comprise depositing athird conductive medium over or within the plurality of secondconductors.

Also for selected exemplary embodiments, the step of depositing thefirst conductive medium further comprises coating the plurality ofcavities with the first conductive medium and removing excess firstconductive medium by scraping a surface of the substrate using a doctorblade. Similarly, the step of depositing the plurality of electroniccomponents further comprises coating the plurality of cavities with theplurality of electronic components and removing excess plurality ofelectronic components by scraping a surface of the substrate using adoctor blade.

In an exemplary embodiment, the plurality of electronic components aresuspended in a binding medium, which may be cured while the plurality ofelectronic components are oriented by the applied field. Typically, thecured binding medium has a dielectric constant greater than about one,to provide at least some degree of electrical insulation for a selectedapplication. Exemplary curing steps include (1) curing the bindingmedium using a substantially uniform and substantially constant appliedelectromagnetic field; (2) curing the binding medium using an appliedultraviolet electromagnetic field; and/or (3) curing the binding mediumusing an applied visible spectrum electromagnetic field.

In another exemplary embodiment, the plurality of electronic componentsare suspended in a solvent. For this embodiment, the exemplary methodfurther comprises evaporating the solvent; and binding the plurality ofelectronic components to the plurality of first conductors while theplurality of electronic components are oriented by the applied field.

For selected embodiments, the exemplary method may further comprisebonding the plurality of electronic components to the first conductor,such as by abutment to or within the first conductor, or by annealingthe plurality of electronic components to the first conductor.

In an exemplary embodiment, the first conductive medium is a conductiveink, which may be cured using applied ultraviolet radiation or appliedheat. Also in an exemplary embodiment, the second conducting medium isan optically transmissive polymer.

The applied field may be an electric field, a magnetic field, or anelectromagnetic field, for example. In addition, the exemplary methodmay further comprise applying a sonic field subsequent to or during thedeposition of the plurality of electronic components, or vibrating thesubstrate subsequent to or during the deposition of the plurality ofelectronic components.

In an exemplary embodiment, the deposition steps further comprise atleast one of the following types of deposition: printing, coating,rolling, spraying, layering, sputtering, lamination, screen printing,inkjet printing, electro-optical printing, electroink printing,photoresist printing, thermal printing, laser jet printing, magneticprinting, pad printing, flexographic printing, hybrid offsetlithography, Gravure printing, and/or printing.

In another exemplary embodiment, the second, optically transmissiveconductive medium forms a second conductor and the exemplary methodfurther comprises depositing a third conductive medium over or withinthe second conductor.

The plurality of electronic components may be light emitting diodes ortransistors, for example. The electronic apparatus may be an addressablelight emitting diode display, a static or regionally-addressable lightemitting diode display, or a lighting apparatus, for example.

In another exemplary embodiment, a method of manufacturing an electronicapparatus comprises: depositing a first conductive medium within aplurality of cavities of a substrate to form a plurality of firstconductors; depositing a plurality of electronic components within theplurality of cavities; orienting the plurality of electronic componentsusing an applied field; and depositing a second, optically transmissiveconductive medium to form a plurality of second conductors.

In yet another exemplary embodiment, a method of manufacturing anaddressable light emitting display comprises: depositing a firstconductive medium within a plurality of cavities of a substrate to forma plurality of first conductors; curing the first conductive mediumusing applied ultraviolet radiation or applied heat; depositing aplurality of light emitting electronic components within the pluralityof cavities, the plurality of light emitting electronic componentssuspended in a binding medium; orienting the plurality of light emittingelectronic components using an applied field; bonding the plurality oflight emitting electronic components to the plurality of firstconductors; curing the binding medium while the plurality of lightemitting electronic components are oriented by the applied field;depositing a second, optically transmissive conductive medium to form aplurality of second conductors coupled to the plurality of lightemitting electronic components; and depositing a third conductive mediumover or within the plurality of second conductors.

In yet another exemplary embodiment, an addressable light emittingapparatus comprises: a substrate having a plurality of cavities; aplurality of first conductors coupled to the substrate and at leastpartially within the cavities, the plurality of first conductors havinga first and substantially parallel orientation; a plurality of lightemitting diodes coupled to the plurality of first conductors and havinga second orientation substantially normal to the first orientation; anda plurality of substantially optically transmissive second conductorscoupled to the plurality of light emitting diodes and having a thirdorientation substantially normal to the second orientation andsubstantially perpendicular to the first orientation. In addition, aplurality of third conductors may be coupled to the plurality of secondconductors and having the third orientation. A cured, opticallytransmissive and electrically insulating material may be coupled to eachof the plurality of light emitting diodes.

The substrate may be substantially flat and have a thickness of lessthan two millimeters. For example, the substrate may comprise at leastone of the following types of substrates: paper, coated paper, plasticcoated paper, embossed paper, fiber paper, cardboard, poster paper,poster board, wood, plastic, rubber, fabric, glass, ceramic, concrete,or stone.

The plurality of cavities may be substantially elongated and have thefirst orientation. Alternatively, the plurality of cavities may besubstantially and partially hemispherically-shaped and are disposed inan array. For this latter embodiment, the plurality of first conductorsmay further comprise a first portion substantially disposed within theplurality of cavities; and a second portion substantially elongated anddisposed in the first orientation.

In an exemplary embodiment, the plurality of first conductors maycomprise a cured conductive ink or a cured conductive polymer. Forexample, the plurality of first conductors may comprise at least one ofthe following types of conductors in a cured form: a silver conductiveink, a copper conductive ink, a gold conductive ink, an aluminumconductive ink, a tin conductive ink, a carbon conductive ink, or aconductive polymer. Similarly, the plurality of second conductors maycomprise an optically transmissive polymer. For example, the pluralityof second conductors may comprise at least one of the following types ofoptically transmissive polymers: antimony tin oxide, indium tin oxide,or polyethylene-dioxithiophene.

In various exemplary embodiments, the plurality of light emitting diodesmay be coupled to or within the plurality of first conductors byabutment, or may be annealed to or within the plurality of firstconductors. In addition, the plurality of first conductors, theplurality of light emitting diodes and the plurality of secondconductors may be deposited through a printing process.

In yet another exemplary embodiment, an addressable apparatus comprises:a substrate having a plurality of cavities; a plurality of firstconductors coupled to the substrate and at least partially within thecavities, the plurality of first conductors having a first andsubstantially parallel orientation; a plurality of electronic componentscoupled to the plurality of first conductors and having a secondorientation substantially normal to the first orientation; and aplurality of second conductors coupled to the plurality of electroniccomponents and having a third orientation substantially normal to thesecond orientation and substantially perpendicular to the firstorientation.

In yet another exemplary embodiment, a light emitting apparatuscomprises: a substrate; a first conductor coupled to the substrate toform a singular, first conductive layer having a first and substantiallyflat orientation; a plurality of light emitting diodes coupled to thefirst conductor and having a second orientation substantially normal tothe first orientation; and a substantially optically transmissive secondconductor coupled to the plurality of light emitting diodes to form asingular, second conductive layer having the first and substantiallyflat orientation.

In such an exemplary embodiment, the substrate may have a plurality ofcavities which are substantially elongated and substantially parallelwithin the first orientation, or the substrate may have a plurality ofcavities which are substantially and partially hemispherically-shapedand are disposed in an array. The first conductor may also furthercomprise a plurality of first conductors, each of the first conductorshaving a first portion substantially disposed within the plurality ofcavities; and a second portion substantially elongated and substantiallyparallel within the first orientation. In another embodiment, the firstconductor may further comprise a plurality of substantially parallelfirst conductors, and the second conductor may further comprises aplurality of second conductors, each of the second conductorssubstantially parallel and substantially perpendicular to the pluralityof first conductors.

Numerous other advantages and features of the present invention willbecome readily apparent from the following detailed description of theinvention and the embodiments thereof, from the claims and from theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects, features and advantages of the present invention will bemore readily appreciated upon reference to the following disclosure whenconsidered in conjunction with the accompanying drawings, wherein likereference numerals are used to identify identical components in thevarious views, and wherein reference numerals with alphabetic charactersare utilized to identify additional types, instantiations or variationsof a selected component embodiment in the various views, in which:

FIG. 1 is a perspective view of a first exemplary substrate 100 for anapparatus embodiment in accordance with the teachings of the presentinvention.

FIG. 2 is a cross-sectional view of the first exemplary substrate 100for an apparatus embodiment in accordance with the teachings of thepresent invention.

FIG. 3 is a perspective view of a first exemplary substrate with aplurality of first conductors having been deposited for an apparatusembodiment in accordance with the teachings of the present invention.

FIG. 4 is a cross-sectional view of the first exemplary substrate with aplurality of first conductors for an apparatus embodiment in accordancewith the teachings of the present invention.

FIG. 5 is a perspective view of a first exemplary substrate 100 with aplurality of first conductors and a plurality of electronic componentshaving been deposited for an apparatus embodiment in accordance with theteachings of the present invention.

FIG. 6 is a cross-sectional view of the first exemplary substrate with aplurality of first conductors and a plurality of electronic componentshaving been deposited for an apparatus embodiment in accordance with theteachings of the present invention.

FIG. 7 is a cross-sectional view with an electronic equivalent circuitelement of an exemplary electronic components oriented in an appliedfield for an apparatus embodiment in accordance with the teachings ofthe present invention.

FIG. 8 is a perspective view of a second exemplary substrate for anapparatus embodiment in accordance with the teachings of the presentinvention.

FIG. 9 is a cross-sectional view of the second exemplary substrate foran apparatus embodiment in accordance with the teachings of the presentinvention.

FIG. 10 is a perspective view of a second exemplary substrate 200 with aplurality of first conductors having been deposited for an apparatusembodiment in accordance with the teachings of the present invention.

FIG. 11 is a cross-sectional view of the second exemplary substrate witha plurality of first conductors for an apparatus embodiment inaccordance with the teachings of the present invention.

FIG. 12 is a perspective view of a second exemplary substrate with aplurality of first conductors having been deposited for an apparatusembodiment in accordance with the teachings of the present invention.

FIG. 13 is a cross-sectional view of the second exemplary substrate witha plurality of first conductors having been deposited for an apparatusembodiment in accordance with the teachings of the present invention.

FIG. 14 is a perspective view of a second exemplary substrate with aplurality of first conductors and a plurality of electronic componentshaving been deposited for an apparatus embodiment in accordance with theteachings of the present invention.

FIG. 15 is a cross-sectional view of the second exemplary substrate witha plurality of first conductors and a plurality of electronic componentshaving been deposited for an apparatus embodiment in accordance with theteachings of the present invention.

FIG. 16 is a first cross-sectional view of a second exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 17 is a perspective view of a first exemplary apparatus embodimentin accordance with the teachings of the present invention.

FIG. 18 is a perspective view of a second exemplary apparatus embodimentin accordance with the teachings of the present invention.

FIG. 19 is a perspective view of a third exemplary apparatus embodimentin accordance with the teachings of the present invention.

FIG. 20 is a first cross-sectional view of the first exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 21 is a second cross-sectional view of the first exemplaryapparatus embodiment in accordance with the teachings of the presentinvention.

FIG. 22 is a second cross-sectional view of a second exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 23 is a cross-sectional view of a fourth exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 24 is a cross-sectional view of a fifth exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 25 is a cross-sectional view of a sixth exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 26 is a cross-sectional view of a seventh exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 27 is a cross-sectional view of a third exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 28 is a cross-sectional view of a third exemplary apparatusembodiment in accordance with the teachings of the present invention.

FIG. 29 is a block diagram illustrating a system embodiment inaccordance with the teachings of the present invention.

FIG. 30 is a flow chart illustrating a method embodiment in accordancewith the teachings of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

While the present invention is susceptible of embodiment in manydifferent forms, there are shown in the drawings and will be describedherein in detail specific exemplary embodiments thereof, with theunderstanding that the present disclosure is to be considered as anexemplification of the principles of the invention and is not intendedto limit the invention to the specific embodiments illustrated. In thisrespect, before explaining at least one embodiment consistent with thepresent invention in detail, it is to be understood that the inventionis not limited in its application to the details of construction and tothe arrangements of components set forth above and below, illustrated inthe drawings, or as described in the examples. Methods and apparatusesconsistent with the present invention are capable of other embodimentsand of being practiced and carried out in various ways. Also, it is tobe understood that the phraseology and terminology employed herein, aswell as the abstract included below, are for the purposes of descriptionand should not be regarded as limiting.

For selected embodiments, the invention disclosed herein is related toU.S. patent application Ser. No. 11/023,064, filed Dec. 27, 2004,inventors William Johnstone Ray et al., entitled “Addressable AndPrintable Emissive Display”, to U.S. patent application Ser. No.11/181,488, filed Jul. 13, 2005, inventors William Johnstone Ray et al.,entitled “Addressable And Printable Emissive Display”, and to U.S.patent application Ser. No. 11/485,031, filed Jul. 12, 2006, inventorsWilliam Johnstone Ray et al., entitled “Static and Addressable EmissiveDisplays” (the “related applications”) which are commonly assignedherewith, the contents of all of which are incorporated herein byreference, and with priority claimed for all commonly disclosed subjectmatter.

FIG. 1 is a perspective view of a first exemplary substrate 100 for anapparatus embodiment 175, 185 in accordance with the teachings of thepresent invention. FIG. 2 is a cross-sectional view (through the 25-25′plane) of the first exemplary substrate 100 for an apparatus embodiment175, 185 in accordance with the teachings of the present invention. Itshould be noted that any reference to apparatus 175 should be understoodto mean and include its variants, and vice-versa, including apparatuses175A, 175B, 175C, and 175D, discussed below. As illustrated in FIGS. 1and 2, the substrate 100 includes a plurality of cavities (or voids)105, which for the selected embodiment, are formed as elongatedcavities, effectively forming channels, grooves or slots (or,equivalently, depressions, valleys, bores, openings, gaps, orifices,hollows, slits, or passages). Another cavity 105 embodiment is discussedbelow with reference to FIG. 8, which illustrates a plurality ofcavities 105 which are shaped to be substantially circular or ellipticaldepressions or bores 205, forming a substrate 200 (which differs fromsubstrate 100 only due to the shape of the cavities 205). Accordingly,any reference herein to cavities 105 or 205 shall be understood to meanand include the other, or any other cavity of any shape or size. Theplurality of cavities 105, 205 are spaced-apart, and which will beutilized to shape and define a plurality of first conductors, asdiscussed below. In addition, the plurality of cavities 105, 205 mayalso be utilized to define a “holding well” for color selection (e.g.,for red, green or blue LEDs 120A, also discussed below). While thecavities or channels 105 are illustrated in FIG. 1 as substantiallyparallel and oriented in the same direction, those having skill in theart will recognize that innumerable variations are available, includingdepth and width of the channels, channel orientation (e.g., circular,elliptical, curvilinear, wavy, sinusoidal, triangular, fanciful,artistic, etc.), spacing variations, type of void or cavity (e.g.,channel, depression or bore), etc., and all such variations areconsidered equivalent and within the scope of the present invention.Substrates 100, 200 having additional forms are illustrated anddiscussed below with reference to FIGS. 8-16, 18, 19, 22-25, 27 and 28.

The substrate 100, 200 may be formed from or comprise any suitablematerial, such as plastic, paper, cardboard, or coated paper orcardboard, for example and without limitation. In an exemplaryembodiment, the substrate 100, 200 comprises an embossed and coatedpaper or plastic having the plurality of cavities 105, 205 formedintegrally therein, such as through a molding process, including anembossed paper or embossed paper board commercially available fromSappi, Ltd., for example. The substrate substrate 100, 200 may comprise,also for example, any one or more of the following: paper, coated paper,plastic coated paper, fiber paper, cardboard, poster paper, posterboard, books, magazines, newspapers, wooden boards, plywood, and otherpaper or wood-based products in any selected form; plastic materials inany selected form (sheets, film, boards, and so on); natural andsynthetic rubber materials and products in any selected form; naturaland synthetic fabrics in any selected form; glass, ceramic, and othersilicon or silica-derived materials and products, in any selected form;concrete (cured), stone, and other building materials and products; orany other product, currently existing or created in the future. In afirst exemplary embodiment, a substrate 100, 200 may be selected whichprovides a degree of electrical insulation (i.e., has a dielectricconstant or insulating properties sufficient to provide electricalisolation of the plurality of first conductors 110 deposited or appliedon that (first) side of the apparatus 175, and its variants 175A, 175B,175C, 175D, 275. For example, while a comparatively expensive choice, asilicon wafer also could be utilized as a substrate 100, 200. In otherexemplary embodiments, however, a plastic-coated paper product isutilized to form the substrate 100, such as the patent stock and 100 lb.cover stock available from Sappi, Ltd., or similar coated papers fromother paper manufacturers such as Mitsubishi Paper Mills, Mead, andother paper products. In additional exemplary embodiments, any type ofsubstrate 100, 200 may be utilized, with additional sealing orencapsulating layers (such as lacquer and vinyl) applied to a surface ofthe substrate 100, 200, as disclosed in the related applications citedabove.

In accordance with the present invention, a plurality of firstconductors 110 are then applied or deposited within the correspondingplurality of cavities 105, 205. As discussed in greater detail below,for the plurality of cavities 205, the plurality of first conductors 110can be deposited in either one step or in two steps, illustrated asplurality of first conductors 110A and 110B. FIG. 3 is a perspectiveview of a first exemplary substrate 100 with a plurality of firstconductors 110 having been deposited for an apparatus embodiment 175,185 in accordance with the teachings of the present invention. FIG. 4 isa cross-sectional view (through the 30-30′ plane) of the first exemplarysubstrate 100 with a plurality of first conductors 110 for an apparatus175, 185 embodiment in accordance with the teachings of the presentinvention. In an exemplary method of manufacturing the exemplaryapparatuses 175, 185, 275, a conductive ink (such as a silver (Ag) ink)is printed or otherwise applied to the substrate 100 (or 200), andsubsequently cured or partially cured (such as through an ultraviolet(uv) curing process), to form the plurality of first conductors 110 (andalso may be utilized to form the plurality of third conductors 145, andalso the bus 310, 315 of FIG. 29 and any electrical or other conductiveterminations discussed below).

Other conductive inks or materials may also be utilized to form thefirst conductors 110, third conductors 145, and any othernon-transmissive conductors such as bus 310, 315, such as copper, tin,aluminum, gold, noble metals or carbon inks, gels or other liquid orsemi-solid materials. In addition, any other printable or coatableconductive substances may be utilized equivalently to form the firstconductors 110, third conductors 145 and/or bus 310, 315, and exemplaryconductive compounds include: (1) From Conductive Compounds(Londonberry, N.H., USA), AG-500, AG-800 and AG-510 Silver conductiveinks, which may also include an additional coating UV-1006S ultravioletcurable dielectric (such as part of a first dielectric layer 125); (2)From DuPont, 7102 Carbon Conductor (if overprinting 5000 Ag), 7105Carbon Conductor, 5000 Silver Conductor (also for bus 310, 315 of FIG.29 and any terminations), 7144 Carbon Conductor (with UV Encapsulants),7152 Carbon Conductor (with 7165 Encapsulant), and 9145 Silver Conductor(also for bus 310, 315 of FIG. 29 and any terminations); (3) FromSunPoly, Inc., 128A Silver conductive ink, 129A Silver and CarbonConductive Ink, 140A Conductive Ink, and 150A Silver Conductive Ink; and(4) From Dow Corning, Inc., PI-2000 Series Highly Conductive Silver Ink.As discussed below, these compounds may also be utilized to form thirdconductors 145, bus 310, 315, and any other conductive traces orconnections. In addition, conductive inks and compounds may be availablefrom a wide variety of other sources.

Conductive polymers may also be utilized to form the plurality of firstconductors 110, third conductors 145 and/or bus 310, 315. For example,polyethylene-dioxithiophene may be utilized, such as thepolyethylene-dioxithiophene commercially available under the trade name“Orgacon” from Agfa Corp. of Ridgefield Park, N.J., USA. Otherconductive polymers, without limitation, which may be utilizedequivalently include polyaniline and polypyrrole polymers, for example.

In an exemplary embodiment, an embossed substrate 100 is utilized, suchthat the substrate 100 has an alternating series of ridges forming(generally smooth) peaks and valleys, generally all having asubstantially parallel orientation, respectively illustrated as raised(or non-channel) portions 115 and cavities (e.g., channels) 105.Conductive inks or polymers may then be applied to remain in either theembossed peaks or valleys, and preferably not to remain in both thepeaks and valleys for addressable displays, creating a plurality offirst conductors 110 which are not only substantially parallel, butwhich also have a physical separation from each other determined by theembossing. Indeed, when the conductive inks or polymers are applied tothe embossed valleys, the corresponding first plurality of conductors110 are also separated from each other by the embossed peaks, creating aphysical and insulated separation in addition to being spaced apart. Forexample, conductive inks or polymers may be applied to an embossedsubstrate in its entirety, and then utilizing a “doctor blade”, theconductive inks or polymers are removed from all of the peaks, such asby scraping the blade across the surface of the substrate 100, 200having a coating of a conductive ink, leaving the conductive inks orpolymers to form a first plurality of conductors 110 having asubstantially parallel orientation. Alternatively, conductive inks orpolymers may be applied (using negligible or zero pressure) to theembossed peaks only, such as by tip printing, also leaving theconductive inks or polymers to form a first plurality of conductorshaving a substantially parallel orientation.

For example, a conductive ink may be coated or otherwise applied inexcess over the entire or most of the substrate 100, 200 with the excessconductive ink subsequently removed using a “doctor blade” or other typeof scraping as known in the printing arts, followed by uv curing of theconductive ink within the plurality of channels 105. Using such a doctorblade, the conductive ink within the plurality of cavities 105, 205 isallowed to remain in place, with the balance of the conductive ink (suchas covering the non-channel portions of the substrate (raised portions115) being removed by the scraping process, such as due to contact fromthe doctor blade. Depending upon the type of printing, including thestiffness of the doctor blade and the applied pressure, the conductiveink may form a meniscus within each of the plurality of cavities 105,205 or may bow upward instead, for example. Those having skill in theelectronic or printing arts will recognize innumerable variations in theways in which the plurality of first conductors 110 may be formed, withall such variations considered equivalent and within the scope of thepresent invention.

As a consequence, as used herein, “printing” means, refers to andincludes any and all printing, coating, rolling, spraying, layering,sputtering, deposition, lamination and/or affixing processes, whetherimpact or non-impact, currently known or developed in the future,including without limitation screen printing, inkjet printing,electro-optical printing, electroink printing, photoresist and otherresist printing, thermal printing, laser jet printing, magneticprinting, pad printing, flexographic printing, hybrid offsetlithography, Gravure and other intaglio printing. All such processes areconsidered printing processes herein, may be utilized equivalently, andare within the scope of the present invention. Also significant, theexemplary printing processes do not require significant manufacturingcontrols or restrictions. No specific temperatures or pressures arerequired. No clean room or filtered air is required beyond the standardsof known printing processes. For consistency, however, such as forproper alignment (registration) of the various successively appliedlayers forming the various embodiments, relatively constant temperature(with a possible exception, discussed below) and humidity may bedesirable. In addition, the various compounds utilized may be containedwithin various polymers, binders or other dispersion agents which may beheat-cured or dried, air dried under ambient conditions, or uv cured,for example, and all such variations are within the scope of the presentinvention.

A particular advantage of use of a substrate 100, 200 having a pluralityof cavities 105, 205 is that printing registration is not required to beexact, and a one-dimensional or relative registration may be sufficientfor the successive applications of the different materials and layersforming the apparatus 175, 185, 275.

It should be noted that depending upon the selected embodiment, thesubstrate 100, 200 may have a substantially flat, smooth or evensurface, without a plurality of cavities 105, 205. For example, when astatic display apparatus 275 is formed, a substrate 100, 200 may beutilized which has a substantially flat, smooth or even surface, and oneor more first conductors 110 may also be deposited as one electrode oras one or more separate electrodes (which also may be substantiallyflat), as a capability or adaptability for separate addressing of aplurality of first conductors 110 would not be required. As discussed ingreater detail below, the resulting apparatus is highly useful forapplications such as lighting or static displays. Such an apparatus 275embodiment is illustrated in FIG. 19, with corresponding cross-sectionsillustrated in FIGS. 27 and 28.

Following deposition of the plurality of first conductors 110, thematerial (such as a conductive ink or polymer) may be cured or partiallycured, to form a solid or semi-solid. In other embodiments, theplurality of first conductors 110 may remain in a liquid form and curedsubsequently. Following the deposition of the plurality of firstconductors 110, with any such curing, partial curing, or non-curing, asuspension of a plurality of electronic components 120 (e.g.,light-emitting diodes (“LEDs”) 120A or transistors 120B) in aninsulating binder 135 is applied over the plurality of first conductors110, and the plurality of electronic components 120 are then orientedusing an applied field 150, such as an electrical or magnetic field, forexample. In an exemplary embodiment, a sonic field is also applied atleast partially concurrently with the application of a substantiallyuniform electrical field. The sonic field is utilized to provide somemechanical vibration to the plurality of electronic components 120, toreduce potentially any inertia of the plurality of electronic components120 and possibly aid in their orientation by the applied electrical ormagnetic field; in other embodiments, other means or forms of vibrationor inertial reduction may be utilized equivalently.

The suspension of a plurality of electronic components 120 in aninsulating binder 135 may be applied, for example, through a printing orcoating process, such as by printing within the plurality of cavities105, 205 having the plurality of first conductors 110. Also for example,the suspension of a plurality of electronic components 120 in aninsulating binder 135 may be coated over the substrate and plurality offirst conductors 110, with any excess removed using a doctor blade orother scraping process. In an exemplary apparatus 175, 185, 275embodiment, the plurality of electronic components 120 are oriented (viaan applied field 150) to be substantially perpendicular to the plane ofthe substrate 100, 200. FIG. 5 is a perspective view and FIG. 6 is across-sectional view (through the 35-35′ plane) of a first exemplarysubstrate 100 with a plurality of first conductors 110 and a pluralityof electronic components 120 having been deposited in an insulatingbinder 135 and oriented in an applied field 150 for an apparatus 175,185, 275 embodiment in accordance with the teachings of the presentinvention.

FIG. 7 is a simplified cross-sectional view with an electronicequivalent circuit element 160 of an exemplary electronic component 120,illustrated as a diode 120A, oriented in an applied field 150 for anapparatus 175, 185 embodiment in accordance with the teachings of thepresent invention. As illustrated, the diode 120A comprises a pnjunction 155 which, due to its dopant composition, has an intrinsicvoltage and corresponding electromagnetic field. Also as illustrated,the diode 120A or other exemplary electronic component 120 may furthercomprise first and second conductors 125 and 130, respectively, whichmay be formed during fabrication as part of or integrated with theexemplary electronic component 120. The present invention advantageouslyexploits effects due to the intrinsic voltage, in which a suspendeddiode 120A or other exemplary electronic component 120 has such anintrinsic voltage and may exhibit a dipole effect. More specifically,when freely suspended and allowed to move (such as within the insulatingbinder 135), such a dipole will move or rotate in response to an appliedelectromagnetic field (150), to become parallel (or antiparallel,depending on the polarity) with the applied field 150.

Other types of applied fields 150 may also be utilized, in addition tostatic or dynamic electrical, magnetic, and/or electromagnetic fields.For example, a sonic field may be utilized to orient certain types ofelectronic components or particles and bond them to the plurality offirst conductors. Other types of radiation, such as uv radiation, orlaser light (such as used to provide laser tweezers), may also be usedas the applied field 150. Temperature curing and/or bonding may also beutilized, depending on the selected embodiment and the selectedelectronic components. The strength of the applied field 150 may also bevaried, for example, to provide sufficient force to create a sufficientelectrical contact between the electronic components and the pluralityof first conductors. Also, the orientation of the applied field may bevaried, such as to be perpendicular to the channels 105 but parallel tothe plane of the substrate 100, for example, depending upon the type ofelectronic components which are being oriented. The ability of theelectronic components such as LEDs 120A to be oriented in a field, suchas an electrical field, may also be utilized to differentiate workingLEDs 120A from non-working LEDs 120A (which may be defective and notexhibit the dipole effect discussed above).

In addition, in exemplary embodiment, electronic components such as LEDs120A may be differentially deposited, such as printing a firstrow/cavity of red LEDs 120A, a second first row/cavity of green LEDs120A, a third first row/cavity of blue LEDs 120A, a fourth firstrow/cavity of red LEDs 120A, etc., creating a color dynamic display, asdiscussed below, with each such LED 120A capable of emitting light ofthe corresponding color (wavelength), and with each such LED 120Adefining a pixel or sub-pixel.

The insulating binder 135 may also include reflective, diffusing orscattering particles, for example, to aid in light transmission in adirection normal to the substrate 100. Also, the electronic components120 may be any type of micro- or nano-machine or device, in addition tothe illustrated diodes and transistors. For example, plasma tubes (usedin plasma displays) may be formed, deposited and oriented using theapplied field 150.

Accordingly, referring to FIGS. 5, 6 and 7, when the plurality ofelectronic components 120 (e.g., light-emitting diodes 120A ortransistors 120B) in an insulating binder 135 is applied over theplurality of first conductors 110, and the plurality of electroniccomponents 120 are then oriented using an applied field 150 (such as anelectrical or magnetic field) as illustrated (with the applied fieldperpendicular to the plane of the substrate 100), the plurality ofelectronic components 120 also become oriented in a directionperpendicular to the plane of the substrate 100. Once the plurality ofelectronic components 120 are aligned or oriented, the insulating binder135 is then cured, holding the oriented plurality of electroniccomponents 120 in place. With such orientation, the plurality ofelectronic components 120 make corresponding electrical contacts withthe plurality of first conductors 110; the first and second conductors125 and 130 formed as part of the plurality of electronic components 120may also facilitate the creation of such electrical contacts with theplurality of first conductors 110. In addition, the creation of suchelectrical contacts may be further facilitated when the plurality offirst conductors 110 have not yet been cured or have only been partiallycured, such that the aligned, oriented plurality of electroniccomponents 120 become embedded within the plurality of first conductors110, followed by curing both the insulating binder 135 and plurality offirst conductors 110 with the aligned, oriented plurality of electroniccomponents 120 in place.

In exemplary embodiments, the field 150 may be applied in any of variousmanners; for example, the applied field may be pulsed initially, such asto help align the plurality of electronic components 120 in the sameorientation (e.g., p side adjacent to the plurality of first conductors110 or n-side adjacent to the plurality of first conductors 110),followed by maintaining the applied field 150 in a comparativelyconstant manner to stabilize the plurality of electronic components 120while the insulating binder 135 is cured or otherwise solidified. In anexemplary embodiment, the field 150 is applied substantially uniformlyand is substantially constant while the insulating binder 135 is uvcured. A sonic field may also be applied initially with an electricfield, followed by discontinuing the sonic field and continuing to applythe electric field 150 substantially uniformly and constantly while theinsulating binder 135 is uv cured. In another exemplary embodiment, a DCelectric field 150 is applied substantially uniformly and issubstantially constant while the insulating binder 135 is non-uv cured,using other wavelengths of electromagnetic radiation, such as within thevisible spectrum. In yet another exemplary embodiment, a DC electricfield 150 is applied substantially uniformly and is substantiallyconstant while (1) the insulating binder 135 is non-uv cured, usingother wavelengths of electromagnetic radiation, such as within thevisible spectrum, followed by (2) uv curing, or vice-versa. In anotherexemplary embodiment, a substantially constant DC electric field 150 isapplied substantially uniformly and it provides the curing of theinsulating binder 135. In another exemplary embodiment, a substantiallyconstant DC electric field 150 is applied substantially uniformly and itprovides the curing of the insulating binder 135, followed by additionalcuring from an AC electromagnetic field, which may be uv or non-uvwavelengths. Also in an exemplary embodiments, upper and lowerelectrodes (not separately illustrated) having various shapes may beutilized to create the substantially uniform electric field, such ashaving the shape of a flat sheet or grate.

The insulating (or dielectric) binder 135, and any second insulating (ordielectric) binder 170, may be comprised of any curable compoundedhaving a reasonably high dielectric constant sufficient to provideelectrical insulation between the plurality of first conductors 110 andthe plurality of second conductors 140 discussed below. A wide varietyof dielectric compounds may be utilized, and all are within the scope ofthe present invention, and may be included within heat- or uv-curablebinders, for example, to form the insulating binder 135, 170. Exemplarydielectric compounds utilized to form the insulating (or dielectric)binder 135 include, without limitation: (1) From Conductive Compounds, abarium titanate dielectric; (2) From DuPont, 5018A Clear UV Cure Ink,5018G Green UV Cure Ink, 5018 Blue UV Cure Ink, 7153 High K DielectricInsulator, and 8153 High K Dielectric Insulator; (3) From SunPoly, Inc.,305D UV Curable dielectric ink and 308D UV Curable dielectric ink; and(4) from various suppliers, Titanium Dioxide-filled UV curable inks.

Those having skill in the art will also recognize that various removableor etchable compounds may also be utilized. For example, once theplurality of electronic components 120 have been embedded within or makesufficient electrical contact with the plurality of first conductors110, have been properly oriented, followed by curing, all or part of theinsulating binder 135 may be removed, such as through an acid or ionetching process. Such an etching or washing process may also facilitateproviding additional electrical contacts with the plurality ofelectronic components 120, such as the subsequent formation ofelectrical contacts with the plurality of second conductors 140 at thecorresponding second ends of the plurality of electronic components 120.Following such an etching or washing process, another or additionaldielectric binders also may be applied and allowed to cure, dependingupon the selected embodiment.

In another variation, the electronic components 120 are suspended in asolvent (instead of the binder 135) and oriented using the appliedfield. The solvent is then allowed to evaporate, such as through theapplication of heat, and while the electronic components are stillproperly oriented, they are bonded to the plurality of first conductors,such as through annealing or other application of heat.

As discussed below with reference to FIG. 26, the ordering between thedeposition of the plurality of first conductors and the deposition ofthe plurality of electronic components in an insulating binder may alsobe reversed.

FIGS. 8-16 serve to illustrate an additional apparatus embodiment 175C,using cavities 205 (in a substrate 200), which are shaped differentlythan the cavities 105, and are discussed herein only to the extent thatthe different shape may require additional or different steps to formthe apparatus 175C.

FIG. 8 is a perspective view of a second exemplary substrate 200 for anapparatus embodiment in accordance with the teachings of the presentinvention. FIG. 9 is a cross-sectional view (through the 45-45′ plane)of the second exemplary substrate 200 for an apparatus embodiment inaccordance with the teachings of the present invention. As illustrated,the substrate 200 differs from the substrate 100 only insofar as theplurality of cavities 105, 205 are shaped differently. The substrate 200has substantially circular or hemi-spherical shaped depressions, dimplesor bores, illustrated as cavities 205, rather than elongated channels orgrooves. For example, the cavities 205 may be partiallyspherically-shaped (e.g., a quarter or an eighth of a sphere) andarranged in a Cartesian array.

FIG. 10 is a perspective view of a second exemplary substrate 200 with aplurality of first conductors 110A having been deposited for anapparatus embodiment in accordance with the teachings of the presentinvention. FIG. 11 is a cross-sectional view (through the 50-50′ plane)of the second exemplary substrate 200 with a plurality of firstconductors 110A for an apparatus embodiment in accordance with theteachings of the present invention. As discussed above, the plurality offirst conductors 110A may be formed identically to the plurality offirst conductors 110, using identical or similar compounds and methods.Rather than forming a series of “wires” however, each of the pluralityof first conductors 110A forms an individual conductive “dot” orsubstantially-circularly shaped conductor.

FIG. 12 is a perspective view of a second exemplary substrate 200 with aplurality of first conductors 110A and 110B having been deposited for anapparatus embodiment in accordance with the teachings of the presentinvention. FIG. 13 is a cross-sectional view (through the 55-55′ plane)of the second exemplary substrate 200 with a plurality of firstconductors 110A and 110B having been deposited for an apparatusembodiment in accordance with the teachings of the present invention. Asmentioned above, FIGS. 10-13 illustrate the deposition of the pluralityof first conductors 110 in two steps, as the plurality of firstconductors 110A and 110B. The plurality of first conductors 110B aredeposited to make electrical contact with the plurality of firstconductors 110A, e.g., forming or providing leads to the plurality offirst conductors 110A, and are shaped to form elongated or “wire” shapedconductors, to provide access to the plurality of first conductors 110Ato and from the more peripheral sections of the substrate 200. Theplurality of first conductors 110B then allow electrical conduction tothe plurality of first conductors 110A, and subsequently to electroniccomponents 120.

Alternatively, the plurality of first conductors 110 may be deposited inone step in this embodiment. For example, the plurality of firstconductors 110 may be printed using a conductive ink, as illustrated forplurality of first conductors 110B, with a portion allowed to flow ordrip into the cavities 205 to form the plurality of first conductors110A.

FIG. 14 is a perspective view of a second exemplary substrate 200 with aplurality of first conductors 110A and 110B and a plurality ofelectronic components 120 having been deposited for an apparatusembodiment in accordance with the teachings of the present invention.FIG. 15 is a cross-sectional view (through the 60-60′ plane) of thesecond exemplary substrate 200 with a plurality of first conductors 110Aand 110B and a plurality of electronic components 120 having beendeposited for an apparatus embodiment in accordance with the teachingsof the present invention. The plurality of electronic components 120 maybe deposited, oriented and cured in an insulating (or dielectric) binder135 as previously discussed.

FIG. 18 is a perspective view of a second exemplary apparatus embodimentin accordance with the teachings of the present invention. FIG. 16 is afirst cross-sectional view (through the 65-65′ plane) and FIG. 22 is asecond cross-sectional view (through the 66-66′ plane) of a secondexemplary apparatus embodiment in accordance with the teachings of thepresent invention, and are similar to the cross-sectional views of FIGS.20 and 21, discussed below. It should be noted, however, that becausethe plurality of first conductors 110B are exposed in FIGS. 14 and 15,rather than confined within a channel-shaped cavity 105, a secondinsulating layer 170 has been applied over the plurality of firstconductors 110B, such as through a printing or coating process, prior todeposition of a plurality of second conductors 140 or a single secondconductor 140 (e.g., a second conductive layer). In addition, the secondinsulating layer 170 may be comprised of any of the insulating ordielectric compounds previously discussed.

FIG. 17 is a perspective view of a first exemplary apparatus embodiment175 in accordance with the teachings of the present invention. FIG. 20is a first cross-sectional view (through the 40-40′ plane) and FIG. 21is a second cross-sectional view (through the 41-41′ plane) of the firstexemplary apparatus embodiment in accordance with the teachings of thepresent invention. FIG. 19 is a perspective view of a third exemplaryapparatus embodiment 275 in accordance with the teachings of the presentinvention. FIG. 27 is a first cross-sectional view (through the 70-70′plane) and FIG. 28 is a second cross-sectional view (through the 71-71′plane) of the third exemplary apparatus embodiment in accordance withthe teachings of the present invention.

Referring to FIGS. 16-28, following orientation of the plurality ofelectronic components 120 and curing of the supporting and stabilizinginsulating binder 135, and following deposition of an additionalinsulating layer(s) (e.g., 170, discussed above), an opticallytransmissive (or transparent) second conductor 140 is applied. Such atransmissive second conductor 140 may be applied as a single electrodeto form a static or regional display, or for lighting applications, asillustrated in FIG. 19, or as a plurality of second conductors 140 (asillustrated in FIGS. 17 and 18) to form an addressable display. Thetransmissive second conductor(s) 140 may be comprised of any compoundwhich: (1) has sufficient conductivity to energize selected portions ofthe apparatus 175, 185, 275 in a predetermined or selected period oftime; and (2) has at least a predetermined or selected level oftransparency or transmissibility for the selected wavelength(s) ofelectromagnetic radiation, such as for portions of the visible spectrum.For example, when the present invention is utilized for a static displayhaving a comparatively smaller form factor, the conductivity time orspeed in which the transmissive second conductor(s) 140 provides energyacross the display to energize the plurality of electronic components120 is comparatively less significant than for other applications, suchas for active displays of time-varying information (e.g., computerdisplays) or for static displays having a comparatively larger formfactor. As a consequence, the choice of materials to form thetransmissive second conductor(s) 140 may differ, depending on theselected application of the apparatus 175, 185, 275 and depending uponthe utilization of optional one or more third conductors 145 (discussedbelow).

The one or more transmissive second conductor(s) 140 are applied overexposed portions of the plurality of electronic components 120 (held inplace by the insulating binder 135), and any additional insulatinglayer(s), using a printing or coating process as known or may becomeknown in the printing or coating arts, with proper control provided forany selected alignment or registration. For example, in the variousexemplary embodiments discussed below, a plurality of transmissivesecond conductors 140 is utilized to create multiple, electricallyisolated electrodes (individual transparent wires), which may be formedduring one or more printing cycles, and which should be properly alignedin comparison with the plurality of first conductors 110, to provide forproper pixel selection using corresponding pixel addressing, as may benecessary or desirable for a selected application. A selected pixel isthen formed by the region of overlap between a selected first conductor110 and a selected second conductor 140, which when energized, providepower to the corresponding electronic component 120 contained therein,such as to cause light emission from a diode 120A. In otherapplications, such as for static displays or signage, in which thetransmissive second conductor 140 may be a unitary sheet as illustratedin FIG. 19, for example, such alignment issues are comparatively lesssignificant.

In the exemplary embodiment of apparatus 175, 185, 275,polyethylene-dioxithiophene (e.g., Orgacon), a polyaniline orpolypyrrole polymer, indium tin oxide (ITO) and/or antimony tin oxide(ATO) is utilized to form the transmissive second conductor(s) 140.While ITO or ATO provides sufficient transparency for visible light, itsimpedance or resistance is comparatively high (e.g., 20 kΩ), generatinga correspondingly comparatively high (i.e., slow) time constant forelectrical transmission across this layer of the apparatus 175, 185,275, such as down a corresponding electrode. Other compounds havingcomparatively less impedance may also be utilized, such aspolyethylene-dioxithiophene. As a consequence, in some of the exemplaryembodiments, one or more third conductors 145 having a comparativelylower impedance or resistance is or may be incorporated intocorresponding transmissive second conductor(s) 140, to reduce theoverall impedance or resistance of this layer, decrease conduction time,and also increase the responsiveness of the apparatus 175, 185, 275 tochanging information for dynamic displays. As indicated above, forstatic displays having larger form factors, such one or more thirdconductors 145 may be utilized to provide more rapid illumination,enabling the energizing of the more central portions of the area to beilluminated, which would otherwise remain non-energized and dark, due tothe insufficient conduction of many types of compounds which may beselected for use in the transmissive second conductor(s) 140. This isalso significant for illumination in various patterns for largerdisplays, such as for rapid blinking or sequential illumination ofdifferent display regions. For example, to form one or more thirdconductors 145, one or more fine wires may be formed using a conductiveink or polymer (e.g., a silver ink or a polyethylene-dioxithiophenepolymer) printed over corresponding strips or wires of the transmissivesecond conductor(s) 140, or one or more fine wires (e.g., having a gridpattern) may be formed using a conductive ink or polymer printed over alarger, unitary transparent second conductor 140 in larger displays, toprovide for increased conduction speed throughout the transparent secondconductor 140.

In an exemplary addressable display embodiment, the one or more thirdconductors 145 are formed as a series of fine wires using a conductiveink, with one or two wires disposed centrally in the longitudinal axisof each second conductor of the plurality of second conductors 140, andhaving a width comparable to the separation between each of the secondconductors of the plurality of second conductors 140. In thisembodiment, an illuminated region may have a visual appearance of twoilluminated pixels, depending upon the selected resolution. In anotherexemplary embodiment, each of the one or more third conductors 145 mayhave a “ladder” shape, with two longitudinal wires being connected toeach other by perpendicular wires.

Other compounds which may be utilized equivalently to form thetransmissive second conductor(s) 140 include indium tin oxide (ITO) asmentioned above, and other transmissive conductors as are currentlyknown or may become known in the art, including one or more of theconductive polymers discussed above, such as polyethylene-dioxithiopheneavailable under the trade name “Orgacon”. Representative transmissiveconductive materials are available, for example, from DuPont, such as7162 and 7164 ATO translucent conductor. The transmissive secondconductor(s) 140 may also be combined with various binders, such asbinders which are curable under various conditions, such as exposure toultraviolet radiation (uv curable).

Referring again to FIG. 19, as mentioned above, the first conductivemedium may be deposited to form a first conductor 110, rather than aplurality of first conductors 110. For example, the first conductor 110may be printed as a larger, flat electrode over the substrate 100, 200.Similarly, the second conductive medium may be deposited to form asecond conductor 140, rather than a plurality of first conductors 140.As an option, one or more third conductors 145 may also be included inthis exemplary embodiment. When the first and second conductors are thenenergized, resulting in the provision of power to the plurality ofelectronic components such as diodes 120A, the diodes 120A emit light inthe visible spectrum. The resulting apparatus 275, therefore, hasparticular usefulness for lighting applications and for static displayapplications.

FIG. 27 is a first cross-sectional view (through the 70-70′ plane) ofthe third exemplary apparatus embodiment in accordance with theteachings of the present invention. FIG. 28 is a second cross-sectionalview (through the 71-71′ plane) of the third exemplary apparatusembodiment in accordance with the teachings of the present invention. Asindicated above, the third apparatus utilizes a single first conductor110 and a single second conductor 140, and optionally may also includeone or more third conductors 145 over or within the second conductor140.

Not separately illustrated in FIGS. 16-28, following deposition of thetransmissive second conductor(s) 140 and the optional one or more thirdconductors 145, various protective coatings may be applied, as indicatedin the related applications incorporated herein by reference. Forexample, the various spaces 42 between the second conductors 140 may befilled in by any of various optically transmissive or opaque materials.In addition, various colors (such as red, green and blue (“RGB”)) may beoverprinted, defining colored pixels over each of the plurality ofelectronic components 120. In another alternative, such as whenlight-emitting diodes 120A are utilized, the various LEDs 120A may beselected to provide corresponding colors, such as corresponding RGBcolors, and printed and aligned to form corresponding pixels.

When one or more of the plurality of first conductors 110 and one ormore of the plurality of transmissive second conductor(s) 140 (and theoptional one or more third conductors 145) are energized, such asthrough the application of a corresponding voltage, energy will besupplied to each of the electronic components 120 (e.g., LEDs 120A) atthe corresponding intersections (overlapping areas) of the energizedfirst conductors 110 and second conductor(s) 140, defining a pixel, forexample. Accordingly, by selectively energizing the first conductors 110and second conductor(s) 140, the apparatus 175, 185 provides apixel-addressable, dynamic display. For example, the plurality of firstconductors 110 may comprise a corresponding plurality of rows, with theplurality of transmissive second conductor(s) 140 (and the optional oneor more third conductors 145) comprising a corresponding plurality ofcolumns, with each pixel defined by the intersection or overlapping of acorresponding row and corresponding column. When a second conductor 140is formed as a unitary sheet, also for example and as illustrated inFIG. 19, energizing of the conductors 110, 140 will provide power tosubstantially all (or most) of the plurality of electronic components120, such as to provide light emission for a static display.

FIG. 23 is a cross-sectional view of a fourth exemplary apparatusembodiment 175A in accordance with the teachings of the presentinvention. FIG. 24 is a cross-sectional view of a fifth exemplaryapparatus embodiment 175B in accordance with the teachings of thepresent invention. FIGS. 23 and 24 illustrate apparatuses withsubstrates 100A and 100B, respectively, having different shapes or formsof cavities 105 and ridges/peaks 115, such as triangular or curvilinearchannels or grooves, for example.

FIG. 25 is a cross-sectional view of a sixth exemplary apparatusembodiment 185 in accordance with the teachings of the presentinvention. The apparatus 185 differs from the apparatus 175 insofar asthe corresponding electronic components 120B are three-terminalcomponents, such as transistors (BJTs or FETs), rather than two-terminalcomponents (such as LEDs 120A). For such an exemplary embodiment,additional conductors are utilized, such as fourth conductors 165, withan additional insulating layer 170, as illustrated. These additional,respective conducting and insulating elements also may be formed throughthe printing and coating processes discussed above, as additional steps.

FIG. 26 is a cross-sectional view of a seventh exemplary apparatusembodiment 175D in accordance with the teachings of the presentinvention. As previously discussed, the ordering between the depositionof the plurality of first conductors 110 and the deposition of theplurality of electronic components 120 in an insulating binder 135 mayalso be reversed. As illustrated in FIG. 26, the plurality of electroniccomponents 120 in an insulating binder 135 may be deposited into thechannels 105 first, then oriented and cured as discussed above. Then,the plurality of first conductors 110 may be formed, such as by printingand curing a conductive ink about or around the electronic components.

FIG. 29 is a block diagram illustrating a system embodiment 300 inaccordance with the teachings of the present invention. The system 300includes an apparatus 175, 185 (such as an addressable display), withthe various pluralities of first conductors 110 and the plurality oftransmissive second conductor(s) 140 (and the optional one or more thirdconductors 145) coupled through lines or connectors 310 (which may be inthe form of a bus) to control bus 315, for coupling to controller (or,equivalently, control logic block) 320, and for coupling to a powersource 350, which may be a DC power source (such as a battery or aphotovoltaic cell) or an AC power source (such as household or buildingpower). The controller 320 comprises a processor 325, a memory 330, andan input/output (I/O) interface 335.

A “processor” 325 may be any type of controller or processor, and may beembodied as one or more processors 325, adapted to perform thefunctionality discussed herein. As the term processor is used herein, aprocessor 325 may include use of a single integrated circuit (“IC”), ormay include use of a plurality of integrated circuits or othercomponents connected, arranged or grouped together, such as controllers,microprocessors, digital signal processors (“DSPs”), parallelprocessors, multiple core processors, custom ICs, application specificintegrated circuits (“ASICs”), field programmable gate arrays (“FPGAs”),adaptive computing ICs, associated memory (such as RAM, DRAM and ROM),and other ICs and components. As a consequence, as used herein, the termprocessor should be understood to equivalently mean and include a singleIC, or arrangement of custom ICs, ASICs, processors, microprocessors,controllers, FPGAs, adaptive computing ICs, or some other grouping ofintegrated circuits which perform the functions discussed below, withassociated memory, such as microprocessor memory or additional RAM,DRAM, SDRAM, SRAM, MRAM, ROM, FLASH, EPROM or EPROM. A processor (suchas processor 325), with its associated memory, may be adapted orconfigured (via programming, FPGA interconnection, or hard-wiring) toperform the methodology of the invention, such as selective pixeladdressing. For example, the methodology may be programmed and stored,in a processor 325 with its associated memory (and/or memory 330) andother equivalent components, as a set of program instructions or othercode (or equivalent configuration or other program) for subsequentexecution when the processor is operative (i.e., powered on andfunctioning). Equivalently, when the processor 325 may implemented inwhole or part as FPGAs, custom ICs and/or ASICs, the FPGAs, custom ICsor ASICs also may be designed, configured and/or hard-wired to implementthe methodology of the invention. For example, the processor 325 may beimplemented as an arrangement of processors, controllers,microprocessors, DSPs and/or ASICs, collectively referred to as a“controller” or “processor”, which are respectively programmed,designed, adapted or configured to implement the methodology of theinvention, in conjunction with a memory 330.

A processor (such as processor 325), with its associated memory, may beconfigured (via programming, FPGA interconnection, or hard-wiring) tocontrol the energizing of (applied voltages to) the various pluralitiesof first conductors 110 and the plurality of transmissive secondconductor(s) 140 (and the optional one or more third conductors 145),for corresponding control over what information is being displayed. Forexample, static or time-varying display information may be programmedand stored, configured and/or hard-wired, in a processor 325 with itsassociated memory (and/or memory 330) and other equivalent components,as a set of program instructions (or equivalent configuration or otherprogram) for subsequent execution when the processor 325 is operative.

The memory 330, which may include a data repository (or database), maybe embodied in any number of forms, including within any computer orother machine-readable data storage medium, memory device or otherstorage or communication device for storage or communication ofinformation, currently known or which becomes available in the future,including, but not limited to, a memory integrated circuit (“IC”), ormemory portion of an integrated circuit (such as the resident memorywithin a processor 325), whether volatile or non-volatile, whetherremovable or non-removable, including without limitation RAM, FLASH,DRAM, SDRAM, SRAM, MRAM, FeRAM, ROM, EPROM or EPROM, or any other formof memory device, such as a magnetic hard drive, an optical drive, amagnetic disk or tape drive, a hard disk drive, other machine-readablestorage or memory media such as a floppy disk, a CDROM, a CD-RW, digitalversatile disk (DVD) or other optical memory, or any other type ofmemory, storage medium, or data storage apparatus or circuit, which isknown or which becomes known, depending upon the selected embodiment. Inaddition, such computer readable media includes any form ofcommunication media which embodies computer readable instructions, datastructures, program modules or other data in a data signal or modulatedsignal, such as an electromagnetic or optical carrier wave or othertransport mechanism, including any information delivery media, which mayencode data or other information in a signal, wired or wirelessly,including electromagnetic, optical, acoustic, RF or infrared signals,and so on. The memory 330 may be adapted to store various look uptables, parameters, coefficients, other information and data, programsor instructions (of the software of the present invention), and othertypes of tables such as database tables.

As indicated above, the processor 325 is programmed, using software anddata structures of the invention, for example, to perform themethodology of the present invention. As a consequence, the system andmethod of the present invention may be embodied as software whichprovides such programming or other instructions, such as a set ofinstructions and/or metadata embodied within a computer readable medium,discussed above. In addition, metadata may also be utilized to definethe various data structures of a look up table or a database. Suchsoftware may be in the form of source or object code, by way of exampleand without limitation. Source code further may be compiled into someform of instructions or object code (including assembly languageinstructions or configuration information). The software, source code ormetadata of the present invention may be embodied as any type of code,such as C, C++, SystemC, LISA, XML, Java, Brew, SQL and its variations,or any other type of programming language which performs thefunctionality discussed herein, including various hardware definition orhardware modeling languages (e.g., Verilog, VHDL, RTL) and resultingdatabase files (e.g., GDSII). As a consequence, a “construct”, “programconstruct”, “software construct” or “software”, as used equivalentlyherein, means and refers to any programming language, of any kind, withany syntax or signatures, which provides or can be interpreted toprovide the associated functionality or methodology specified (wheninstantiated or loaded into a processor or computer and executed,including the processor 325, for example).

The software, metadata, or other source code of the present inventionand any resulting bit file (object code, database, or look up table) maybe embodied within any tangible storage medium, such as any of thecomputer or other machine-readable data storage media, ascomputer-readable instructions, data structures, program modules orother data, such as discussed above with respect to the memory 330,e.g., a floppy disk, a CDROM, a CD-RW, a DVD, a magnetic hard drive, anoptical drive, or any other type of data storage apparatus or medium, asmentioned above.

The I/O interface 335 may be implemented as known or may become known inthe art, and may include impedance matching capability, voltagetranslation for a low voltage processor to interface with a highervoltage control bus 315, and various switching mechanisms (e.g.,transistors) to turn various lines or connectors 310 on or off inresponse to signaling from the processor 325. In addition, the I/Ointerface 335 may also be adapted to receive and/or transmit signalsexternally to the system 300, such as through hard-wiring or RFsignaling, for example, to receive information in real-time to control adynamic display, for example.

In addition to the controller 320 illustrated in FIG. 29, those of skillin the art will recognize that there are innumerable equivalentconfigurations, layouts, kinds and types of control circuitry known inthe art, which are within the scope of the present invention.

FIG. 30 is a flow chart illustrating a method embodiment in accordancewith the teachings of the present invention, for forming or otherwisemanufacturing the apparatus 175, 185, and provides a useful summary.Beginning with start step 400, the method deposits a plurality of firstconductors within a corresponding plurality of channels of a substrate,step 405, such as by printing a conductive ink, followed by curing orpartially curing the conductive ink, step 410. A plurality of electroniccomponents, typically suspended in a binder, are then deposited over theplurality of first conductors in the corresponding channels, step 415.The electronic components are then oriented using an applied field, step420. With the oriented electronic components, the binder is then cured,resulting in stabilized or fixed electronic components in electricalcontact at a first end with the plurality of first conductors, step 425.As an option, additional insulating layers may also be applied. Next, aplurality of transmissive second conductors are then deposited andcured, making electrical contact at a second end with the plurality ofelectronic components, step 430. In exemplary embodiments, such as foran addressable display, the plurality of transmissive second conductorsare oriented substantially perpendicular to the plurality of firstconductors. Optionally, a plurality of third conductors are thendeposited (and cured) over the corresponding plurality of transmissivesecond conductors, step 435, followed by any deposition (such as throughprinting) of selected colors or protective coatings, step 440, and themethod may end, return step 445.

Although the invention has been described with respect to specificembodiments thereof, these embodiments are merely illustrative and notrestrictive of the invention. In the description herein, numerousspecific details are provided, such as examples of electroniccomponents, electronic and structural connections, materials, andstructural variations, to provide a thorough understanding ofembodiments of the present invention. One skilled in the relevant artwill recognize, however, that an embodiment of the invention can bepracticed without one or more of the specific details, or with otherapparatus, systems, assemblies, components, materials, parts, etc. Inother instances, well-known structures, materials, or operations are notspecifically shown or described in detail to avoid obscuring aspects ofembodiments of the present invention. In addition, the various Figuresare not drawn to scale and should not be regarded as limiting.

Reference throughout this specification to “one embodiment”, “anembodiment”, or a specific “embodiment” means that a particular feature,structure, or characteristic described in connection with the embodimentis included in at least one embodiment of the present invention and notnecessarily in all embodiments, and further, are not necessarilyreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics of any specific embodiment of the presentinvention may be combined in any suitable manner and in any suitablecombination with one or more other embodiments, including the use ofselected features without corresponding use of other features. Inaddition, many modifications may be made to adapt a particularapplication, situation or material to the essential scope and spirit ofthe present invention. It is to be understood that other variations andmodifications of the embodiments of the present invention described andillustrated herein are possible in light of the teachings herein and areto be considered part of the spirit and scope of the present invention.

It will also be appreciated that one or more of the elements depicted inthe Figures can also be implemented in a more separate or integratedmanner, or even removed or rendered inoperable in certain cases, as maybe useful in accordance with a particular application. Integrally formedcombinations of components are also within the scope of the invention,particularly for embodiments in which a separation or combination ofdiscrete components is unclear or indiscernible. In addition, use of theterm “coupled” herein, including in its various forms such as “coupling”or “couplable”, means and includes any direct or indirect electrical,structural or magnetic coupling, connection or attachment, or adaptationor capability for such a direct or indirect electrical, structural ormagnetic coupling, connection or attachment, including integrally formedcomponents and components which are coupled via or through anothercomponent.

As used herein for purposes of the present invention, the term “LED” andits plural form “LEDs” should be understood to include anyelectroluminescent diode or other type of carrier injection- orjunction-based system which is capable of generating radiation inresponse to an electrical signal, including without limitation, varioussemiconductor- or carbon-based structures which emit light in responseto a current or voltage, light emitting polymers, organic LEDs, and soon, including within the visible spectrum, or other spectra such asultraviolet or infrared, of any bandwidth, or of any color or colortemperature.

Furthermore, any signal arrows in the drawings/Figures should beconsidered only exemplary, and not limiting, unless otherwisespecifically noted. Combinations of components of steps will also beconsidered within the scope of the present invention, particularly wherethe ability to separate or combine is unclear or foreseeable. Thedisjunctive term “or”, as used herein and throughout the claims thatfollow, is generally intended to mean “and/or”, having both conjunctiveand disjunctive meanings (and is not confined to an “exclusive or”meaning), unless otherwise indicated. As used in the description hereinand throughout the claims that follow, “a”, “an”, and “the” includeplural references unless the context clearly dictates otherwise. Also asused in the description herein and throughout the claims that follow,the meaning of “in” includes “in” and “on” unless the context clearlydictates otherwise.

The foregoing description of illustrated embodiments of the presentinvention, including what is described in the summary or in theabstract, is not intended to be exhaustive or to limit the invention tothe precise forms disclosed herein. From the foregoing, it will beobserved that numerous variations, modifications and substitutions areintended and may be effected without departing from the spirit and scopeof the novel concept of the invention. It is to be understood that nolimitation with respect to the specific methods and apparatusillustrated herein is intended or should be inferred. It is, of course,intended to cover by the appended claims all such modifications as fallwithin the scope of the claims.

It is claimed:
 1. A method of manufacturing a light emitting apparatus,the method comprising: depositing a plurality of first conductors on abase, housing or substrate; depositing a plurality of light emittingdiodes suspended in a liquid or gel on a first conductor of theplurality of first conductors to provide that the plurality of lightemitting diodes are distributed substantially randomly or stochasticallyon the first conductor of the plurality of first conductors; orientingthe plurality of light emitting diodes to provide that at least some ofthe plurality of light emitting diodes have a first diode orientationand at least one first light emitting diode of the plurality of lightemitting diodes has a second diode orientation opposite or inverted fromthe first diode orientation; and depositing at least one secondconductor coupled to the plurality of light emitting diodes and coupledto a second conductor of the plurality of first conductors; anddepositing a protective coating.
 2. The method of claim 1, wherein thefirst diode orientation is a forward-bias diode orientation and thesecond diode orientation is a reverse-bias orientation.
 3. The method ofclaim 1, wherein the first diode orientation is an upward, parallelorientation of the diode pn junction with respect to the plane of thefirst conductor of the plurality of first conductors and the seconddiode orientation is a downward, anti-parallel orientation of the diodepn junction, of the at least one first diode, with respect to the planeof the first conductor of the plurality of first conductors.
 4. Themethod of claim 3, wherein the first and second diode orientations arein a z-axis perpendicular to the plane of the first conductor of theplurality of first conductors.
 5. The method of claim 4, wherein atleast one second light emitting diode of the plurality of light emittingdiodes has a third diode orientation different from the first and seconddiode orientations.
 6. The method of claim 5, wherein the third diodeorientation is a sideways diode pn junction substantially perpendicularto the pn junctions of the first and second diode orientations.
 7. Themethod of claim 5, wherein the at least one second light emitting diodeof the plurality of light emitting diodes having the third diodeorientation does not make electrical contact to both the secondconductor and the first conductor of the plurality of first conductors.8. The method of claim 1, further comprising: depositing a luminescentlayer.
 9. The method of claim 8, wherein the luminescent layer comprisesa phosphor.
 10. The method of claim 1, wherein the base, housing orsubstrate is substantially transparent or translucent.
 11. The method ofclaim 1, further comprising: orienting the plurality of light emittingdiodes using an applied electromagnetic field.
 12. The method of claim1, further comprising: orienting the plurality of diodes using anapplied mechanical force.
 13. The method of claim 12, wherein theapplied mechanical force comprises a printing process.
 14. The method ofclaim 12, wherein the applied mechanical force comprises a sonicationprocess.
 15. An apparatus formed by the method of claim
 1. 16. Themethod of claim 1, wherein following the deposition of the secondconductor, the plurality of light emitting diodes are coupled inparallel between the first conductor of the plurality of firstconductors and the second conductor.
 17. A light emitting apparatus,comprising: a base, housing or substrate; an electrical interfacecoupled to the base, housing or substrate and couplable to a powersource; a plurality of first conductors coupled to the base, housing orsubstrate; a plurality of light emitting diodes distributedsubstantially randomly or stochastically and in parallel on a firstconductor of the plurality of first conductors, at least some lightemitting diodes of the plurality of light emitting diodes having a firstdiode orientation and at least one first light emitting diode of theplurality of light emitting diodes having a second diode orientationopposite or inverted from the first diode orientation; at least onesecond conductor coupled to the plurality of light emitting diodes andcoupled to a second conductor of the plurality of first conductors; anda protective coating.
 18. The apparatus of claim 17, wherein the firstdiode orientation is a forward-bias diode orientation and the seconddiode orientation is a reverse-bias orientation.
 19. The apparatus ofclaim 18, wherein each light emitting diode of the plurality of lightemitting diodes has a first, p-side conductive terminal and a second,n-side conductive terminal, and wherein the first diode orientationcomprises a plurality of first, p-side conductive terminals coupled tothe at least one second conductor for the at least some light emittingdiodes of the plurality of light emitting diodes and the second diodeorientation comprises at least one second, n-side conductive terminalcoupled to the at least one second conductor for the at least one firstlight emitting diodes of the plurality of light emitting diodes.
 20. Theapparatus of claim 17, wherein the first diode orientation is an upward,parallel orientation of the diode pn junction with respect to the planeof the first conductor of the plurality of first conductors and thesecond diode orientation is a downward, anti-parallel orientation of thediode pn junction, of the at least one first diode, with respect to theplane of the first conductor of the plurality of first conductors. 21.The apparatus of claim 20, wherein the first and second diodeorientations are in a z-axis perpendicular to the plane of the firstconductor of the plurality of first conductors.
 22. The apparatus ofclaim 21, wherein at least one second light emitting diode of theplurality of light emitting diodes has a third diode orientationdifferent from the first and second diode orientations.
 23. Theapparatus of claim 22, wherein the third diode orientation is a sidewaysdiode pn junction substantially perpendicular to the pn junctions of thefirst and second diode orientations.
 24. The apparatus of claim 22,wherein the at least one second light emitting diode of the plurality oflight emitting diodes having the third diode orientation does not makeelectrical contact to both the second conductor and the first conductorof the plurality of first conductors.
 25. The apparatus of claim 17,further comprising: a luminescent layer.
 26. The apparatus of claim 25,wherein the luminescent layer comprises a phosphor.
 27. The apparatus ofclaim 17, wherein the base, housing or substrate is substantiallytransparent or translucent.
 28. The apparatus of claim 17, wherein thebase, housing or substrate has a dielectric constant or insulatingproperties sufficient to provide electrical isolation, and whereineither or both the base, housing or substrate and the protective coatingform a weatherproof seal.
 29. The apparatus of claim 17, wherein thebase, housing or substrate comprises a plastic or polymer film havingadherent properties for signage or lighting.
 30. A light emittingapparatus, comprising: a substantially transparent or translucent base,housing or substrate; an electrical interface coupled to the base,housing or substrate and couplable to a power source; a plurality offirst conductors coupled to the base, housing or substrate; a pluralityof light emitting diodes distributed substantially randomly orstochastically and in parallel on a first conductor of the plurality offirst conductors, at least some light emitting diodes of the pluralityof light emitting diodes having a first, forward-bias diode orientationand at least one first light emitting diode of the plurality of lightemitting diodes having a second, reverse-bias diode orientation; atleast one second conductor coupled to the plurality of light emittingdiodes and coupled to a second conductor of the plurality of firstconductors; a luminescent layer; and a protective coating.